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Special issue: Micro-electromechanical systems (MEMS)
Zhuangde JIANG
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 457-458 doi: 10.1007/s11465-017-0492-4
Xuejun Fan,Liangbiao Chen,C. P. Wong,Hsing-Wei Chu,G. Q. Zhang
Engineering 2015, Volume 1, Issue 3, Pages 384-390 doi: 10.15302/J-ENG-2015034
Modeling vapor pressure is crucial for studying the moisture reliability of microelectronics, as high vapor pressure can cause device failures in environments with high temperature and humidity. To minimize the impact of vapor pressure, a super-hydrophobic (SH) coating can be applied on the exterior surface of devices in order to prevent moisture penetration. The underlying mechanism of SH coating for enhancing device reliability, however, is still not fully understood. In this paper, we present several existing theories for predicting vapor pressure within microelectronic materials. In addition, we discuss the mechanism and effectiveness of SH coating in preventing water vapor from entering a device, based on experimental results. Two theoretical models, a micro-mechanics-based whole-field vapor pressure model and a convection-diffusion model, are described for predicting vapor pressure. Both methods have been successfully used to explain experimental results on uncoated samples. However, when a device was coated with an SH nanocomposite, weight gain was still observed, likely due to vapor penetration through the SH surface. This phenomenon may cast doubt on the effectiveness of SH coatings in microelectronic devices. Based on current theories and the available experimental results, we conclude that it is necessary to develop a new theory to understand how water vapor penetrates through SH coatings and impacts the materials underneath. Such a theory could greatly improve microelectronics reliability.
Keywords: vapor pressure moisture semiconductor reliability microelectromechanical systems (MEMS) super-hydrophobic
Additive direct-write microfabrication for MEMS: A review
Kwok Siong TEH
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 490-509 doi: 10.1007/s11465-017-0484-4
Keywords: direct-write additive manufacturing microfabrication MEMS
Review of MEMS differential scanning calorimetry for biomolecular study
Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 526-538 doi: 10.1007/s11465-017-0451-0
Keywords: differential scanning calorimetry biomolecule MEMS thermodynamic
Dependence of error sensitivity of frequency on bias voltage in force-balanced micro accelerometer
Lili CHEN, Wu ZHOU
Frontiers of Mechanical Engineering 2013, Volume 8, Issue 2, Pages 146-149 doi: 10.1007/s11465-013-0260-z
To predict more precisely the frequency of force-balanced micro accelerometer with different bias voltages, the effects of bias voltages on error sensitivity of frequency is studied. The resonance frequency of accelerometer under closed loop control is derived according to its operation principle, and its error sensitivity is derived and analyzed under over etching structure according to the characteristics of Deep Reaction Ion Etching (DRIE). Based on the theoretical results, micro accelerometer is fabricated and tested to study the influences of AC bias voltage and DC bias voltage on sensitivity, respectively. Experimental results indicate that the relative errors between test data and theory data are less than 7%, and the fluctuating value of error sensitivity under the range of voltage adjustment is less than 0.01 μm . It is concluded that the error sensitivity with designed parameters of structure, circuit and process error can be used to predict the frequency of accelerometer with no need to consider the influence of bias voltage.
Keywords: Micro-Electro-Mechanical Systems (MEMS) micro accelerometer force-balanced micro accelerometer frequency
MEMS-based thermoelectric infrared sensors: A review
Dehui XU, Yuelin WANG, Bin XIONG, Tie LI
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 557-566 doi: 10.1007/s11465-017-0441-2
In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensorsThis paper presents a review of MEMS-based thermoelectric IR sensors.
Keywords: thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package
Frontiers of Mechanical Engineering 2023, Volume 18, Issue 2, doi: 10.1007/s11465-023-0747-1
Keywords: micro-electro-mechanical system capacitive sensor bionics operation instability mechanical and electrical decoupling biomedical force measurement
Wang Weiyuan,Wang Yuelin
Strategic Study of CAE 2002, Volume 4, Issue 6, Pages 56-62
The packaging of micro electro mechanical systems (MEMS) is referred to first-level packaging andhigh importance not to forget packaging at the beginning of a project, when hoping to industrialize MEMS
Keywords: packaging of MEMS bulk silicon bonding technology film-sealed technology
Research of MEMS and Development of One-chip RF - MEMS
Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang
Strategic Study of CAE 2004, Volume 6, Issue 7, Pages 21-25
Keywords: microsystem integration one-chip wireless communication system
Ming-jun MA,Zhong-he JIN,Hui-jie ZHU
Frontiers of Information Technology & Electronic Engineering 2015, Volume 16, Issue 6, Pages 497-510 doi: 10.1631/FITEE.1400349
Keywords: Bias drift Closed-loop MEMS accelerometer Modulated feedback approach Temperature compensation
Development and application of high-end aerospace MEMS
Weizheng YUAN
Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 567-573 doi: 10.1007/s11465-017-0424-3
This paper introduces the design and manufacturing technology of aerospace microelectromechanicalsystems (MEMS) characterized by high performance, multi-variety, and small batch.Moreover, several kinds of special MEMS devices with high precision, high reliability, and environmental
Keywords: MEMS design and manufacture technology aeronautic and aerospace
The electrostatic-alloy bonding technique used in MEMS
WANG Wei, CHEN Wei-ping
Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2, Pages 238-241 doi: 10.1007/s11465-006-0011-5
Keywords: Si/Au-glass strength MEMS packaging process sandwich structure
Wireless passive flexible accelerometer fabricated using micro-electro-mechanical system technology for bending structure surfaces Research Article
Chen LI, Mangu JIA, Yingping HONG, Yanan XUE, Jijun XIONG,lichen@nuc.edu.cn
Frontiers of Information Technology & Electronic Engineering 2022, Volume 23, Issue 5, Pages 801-809 doi: 10.1631/FITEE.2100236
Keywords: Bending structure surfaces Flexible accelerometer Micro-electro-mechanical system (MEMS) technology
Peng Chunrong: MEMS Sensor Technology for Power Internet of Things (2020-8-17)
17 Oct 2022
Keywords: 信息技术
Current status and prospects of reliability systems engineering in China
Frontiers of Engineering Management 2021, Volume 8, Issue 4, Pages 492-502 doi: 10.1007/s42524-021-0172-2
Keywords: reliability effectiveness model-based systems engineering reliability systems engineering
Title Author Date Type Operation
Effects of Vapor Pressure and Super-Hydrophobic Nanocomposite Coating on Microelectronics Reliability
Xuejun Fan,Liangbiao Chen,C. P. Wong,Hsing-Wei Chu,G. Q. Zhang
Journal Article
Review of MEMS differential scanning calorimetry for biomolecular study
Shifeng YU, Shuyu WANG, Ming LU, Lei ZUO
Journal Article
Dependence of error sensitivity of frequency on bias voltage in force-balanced micro accelerometer
Lili CHEN, Wu ZHOU
Journal Article
MEMS-based thermoelectric infrared sensors: A review
Dehui XU, Yuelin WANG, Bin XIONG, Tie LI
Journal Article
A bionic approach for the mechanical and electrical decoupling of an MEMS capacitive sensor in ultralow
Journal Article
Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology
Wang Weiyuan,Wang Yuelin
Journal Article
Research of MEMS and Development of One-chip RF - MEMS
Zhong Xianxin,Yu Wenge,Li Xiaoyi,Wu Zhengzhong,Liu Jixue,Chen Shuai,Shao Xiaoliang
Journal Article
combined modulated feedback and temperature compensation approach to improve bias drift of a closed-loop MEMS
Ming-jun MA,Zhong-he JIN,Hui-jie ZHU
Journal Article
Wireless passive flexible accelerometer fabricated using micro-electro-mechanical system technology for bending structure surfaces
Chen LI, Mangu JIA, Yingping HONG, Yanan XUE, Jijun XIONG,lichen@nuc.edu.cn
Journal Article
Peng Chunrong: MEMS Sensor Technology for Power Internet of Things (2020-8-17)
17 Oct 2022
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